Independent Developed Software System

High modularization、 fast response、strong universality; Include multi thread structure、State Machine、KLT(Kernel Level Thread)、Machine Vision、Communication Library complying with SECS/GEM、Mapping etc. core module.

Intelligent Picking Up Die

Pre-recognize and plan the path matrix of dies intelligently to improve by 20% in speed of picking up.

Accurate Force Control for Bond-Head

Independent developed picking up force control of bond-head, could control the force tolerance within ±g, to eliminate the damage of die.

Simultaneous to Absorb and Eject Die

Protect dies from cracking, improve the picking up speed by 20%.

High Speed Dispensing

Improve efficiency by 30%；Develop continuous interpolation in solder dispensing and drives it to apply and develop in automation industry.

Post-bond Inspection

Post-bond by bond camera. Capture immediately at setting time to setup bond position at correct location.Run-time monitoring of bond placement and alert when placement exceeded set limits.Selectable inspection sampling mode to reduce overhead on producti

Anti-reverse Function on Chip

Robust gate recognition technology with chip anti reverse function based on gate position inspection. Alert when the installation angle of the wafer is different from the setting. Moreover, also alert when the chip orientation of the multi row frame is in