Shandong Yuzheng Automation Technology Co.,Ltd.

HX912S plus-Soft Solder Die Bonder (Dual Tunnels)

1、Independent developed software with high compatibility, and Mapping can read files with various formats；
2、 UPH improve 50%+ more than single tunnel ；
3、Real-time status displaying, warning with solution advice ;
4、Lead-frame location recognition、Poka Yoke setting、strong adaptability ；
5、Bond material de-oxidation、bond head pull force adjustable， fast switch between single/dual dispensers，bonding content test,  Post bond test；
6、Wafer auto-changing、360° rotating、angle auto amending；
7、Module turn on /off independently to easy to debug,  log auto saving by catalog to easy to trace；
8、Touch operation、Poka Yoke setting、permission setting、one-click switch between CN & EN.

HX912S plus-Soft Solder Die Bonder (Dual Tunnels)

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